Small Mini Reflow Oven (NeoDen IN6) with Hot Air for Soldering PCB Assembly

Overview

Basic Info.

Model NO.	IN6
Temperature Distribution Deviation	+/-1 Degree Celsius
Temperature Range	Room Temperature-300 Degree Celsius
Heat-up Time	15min
Machine Dimension	1020X507X350mm (Lxwxh)
Chamber Process Length	680mm (26.8 Inches)
Soldering Width	260mm (10 Inches)
Heating Type	Nichrome Wire and Aluminum Alloy Heating
Standard Heating Height	30mm
Conveyor Speed	15-60cm/Min, 6-23 Inch/Min
Rated Power	2kw
Heating Zone	Upper3/ Bottom3
Application	Lead/ Lead-Free Soldering PCB
Transport Package	Heavy-Duty Carton
Specification	CE
Trademark	Neoden
Origin	Zhejiang, Cn
HS Code	8515809090
Production Capacity	200sets/M

Product Description

Lead/ Lead-free soldering oven
Model: IN6
A power-saved soldering equipment, can be used in pcb prototype project or small batch PCBA manufacturing. Small body and beautiful design, good choice for labs or universities.
Product Parameters

Power requirement	110/220VAC 1-phase
Power max.	2KW
Heating zone quantity	upper3/down3
Conveyor speed	15 - 60 cm/min (6 - 23 inch/min)
Standard Max Height	30mm
Temperature control range	Room temperature~300 degree celsius
Temperature control accuracy	±0.2 degree celsius
Temperature distribution deviation	±1 degree celsius
Soldering width	260 mm (10 inch)
Length process chamber	680 mm (26.8 inch)
Heat-up time	approx. 15 min
Dimensions	1020 x 507 x 350 mm (L x W x H)
Packing Size	112x 62x 56cm
N.W./ G.W.	49KG/ 64kg (without working table)

If you need the related working bench below, you can buy it by extra with USD199:

IN6 with two different exhuast ways:
1) By normal exhuast pipe, directly discharge the air outside;
2) By built-in smoke filtering system (IN6 special-designed), do not need pipe, and it can filtering the smoke automatically, environment friendly
Feature

1. Full convection, excellent soldering performance.

2. 6 zones design, light and compact.
3. Smart control with high sensitivity temperature sensor, the temperature can be stabilized within + 0.2ºC.
4.ESD tray, easy to collect PCB after reflowing, convenient for R&D and prototype
5. Original built-in soldering smoke filtering system, elegant appearance and eco-friendly.
6. Heat insulation protection design, the casing temperature can be controlled within 40ºC.
7. Several working files can be stored, freely switch between Celsius and Fahrenheit, flexible and easy to understand.
8. Japan NSK hot-air motor bearings and Swiss heating wire, durable and stable.
9.Original high-performance aluminum alloy heating plate instead of heating pipe, both energy-saving and high-efficient, and transverse temperature difference is less than 2ºC.
10. Approved by TUV CE, authoritative and reliable.
11. PCB soldering temperature curve can be displayed based on real-time measurement.
Detailed Photos

The complete machine has a warranty period of 1 year from the time of purchse and lifelong service support. We provide online Q/A and troubleshooting support and technical advice service.
FAQ

What is reflow soldering

The basic process behind reflow or to provide its full name, infra-red reflow soldering requires that solder paste is applied to the relevant areas of the board.
The components are then placed, and then the assembly is passed through a tunnel where the board is heated in a controlled manner so that the solder paste melts and the components are electrically secured to the printed circuit board.
Using reflow soldering technology it is possible to reliably solder surface mount components, and particularly those with very fine pitch leads. This makes it ideal for use with the components used in mass produced electronics products.

What is a brief SMT process
Preparation board/ solder paste→ Screen printing→ Component placement→ Component inspection→ Reflow soldering→ Cleaning→ Solder joint inspection→ Cicuit testing→ Packaging → Finish.

Company Profile
Overseas ExhibitionMore information required, just contact us freely.